Hot plate baking glue machine JS-HP220

Product Description

Used for single-sided baking of wafers, can be used for pre-bake (Pre-bake), pre-bake (soft bake), primer coating (Primer Vapor) and post-bake (hardbake firm film) process. Adapted to semiconductor wafers, slides, wafers, substrates, ITO conductive glass and other processes, plate surface coating, film drying, curing. The hot plate temperature stability is high and repeatability is good. Can be used in industrial and mining enterprises, scientific research, education and other units for production, research, teaching.

Product Specification

Heating area size: 160mm*160mm, 220mm*220mm, can be customized
Temperature control range: room temperature - 400℃.
Temperature resolution : 0.1℃
Temperature fluctuation: ≤±0.5°C
Temperature uniformity: ≤ ± 1%
Power input: AC220V 10A
Heating power: 1500W
Hot plate surface: made of hard anodized aluminum

Product Features

Precision glue baking machine, high precision glue drying machine Features:
Very good stability performance, temperature stability up to ± 0.5 ℃.
Wide temperature adjustment range: room temperature-400°C
Adopting closed-loop control, the heating speed is fast.
With timer function. Also with countdown display function.
Adopting digital buttons to control the temperature and time, the temperature and time setting is more accurate.
The body is all made of stainless steel, acid and alkali resistant and corrosion resistant.
We provide customized heating plate service for the size of customer's substrate.

Optional features are available:
Support pin material
Edge support pin
N2 purge, non-oxidizing bake
Baking distance adjustable module
Vacuum chamber
Intelligent Control System